Semiconductor Dicing Saw

This machine uses a thin diamond blade mounted on a high speed air bearing spindle to dice semiconductor wafers and substrates. The design of this machine was well suited to laboratory and light production work. Three stepping motors controlled cut to cut spacing, depth of cut and rotation of the wafers or substrate while an air-over-oil hydraulic system provided smooth infinitely variable feed of the wafers or substrate under the diamond wheel. Water cooling of the cutting process was included to extend blade life and produce burr and chip free cuts.